Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.
Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR's investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
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This report aims to provide a comprehensive presentation of the global market for Semiconductor Die Attach Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Die Attach Materials. This report contains market size and forecasts of Semiconductor Die Attach Materials in global, including the following market information:
Global Semiconductor Die Attach Materials Market Revenue, 2018-2023, 2024-2032, ($ millions)
Global Semiconductor Die Attach Materials Market Sales, 2018-2023, 2024-2032, (Kiloton)
Global top five Semiconductor Die Attach Materials companies in 2022 (%)
The global Semiconductor Die Attach Materials market was valued at US$ 586.8 million in 2022 and is projected to reach US$ 856.5 million by 2029, at a CAGR of 5.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The major players in global Die-Attach Materials market include Alpha Assembly Solutions, SMIC, Shenmao Technology, etc. The top 3 players occupy about 40% shares of the global market. Asia Pacific and North America are main markets, they occupy about 90% of the global market. Die Attach Paste is the main type, with a share about 85%. SMT Assembly is the main application, which holds a share about 50%.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Die Attach Materials manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Die Attach Materials Market, by Type, 2018-2023, 2024-2032 ($ Millions) & (Kiloton)
Global Semiconductor Die Attach Materials Market Segment Percentages, by Type, 2022 (%)
Die Attach Paste
Die Attach Wire
Others
Global Semiconductor Die Attach Materials Market, by Application, 2018-2023, 2024-2032 ($ Millions) & (Kiloton)
Global Semiconductor Die Attach Materials Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Global Semiconductor Die Attach Materials Market, By Region and Country, 2018-2023, 2024-2032 ($ Millions) & (Kiloton)
Global Semiconductor Die Attach Materials Market Segment Percentages, By Region and Country, 2022 (%)
North America (United States, Canada, Mexico)
Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
The Middle East and Africa (Middle East, Africa)
South and Central America (Brazil, Argentina, Rest of SCA)
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Die Attach Materials revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semiconductor Die Attach Materials revenues share in global market, 2022 (%)
Key companies Semiconductor Die Attach Materials sales in global market, 2018-2023 (Estimated), (Kiloton)
Key companies Semiconductor Die Attach Materials sales share in global market, 2022 (%)
Key players include:
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
DuPont
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Die Attach Materials, market overview.
Chapter 2: Global Semiconductor Die Attach Materials market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Die Attach Materials manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Die Attach Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Die Attach Materials capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
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Table of content
1 Introduction to Research & Analysis Reports 1.1 Semiconductor Die Attach Materials Market Definition 1.2 Market Segments 1.2.1 Market by Type 1.2.2 Market by Application 1.3 Global Semiconductor Die Attach Materials Market Overview 1.4 Features & Benefits of This Report 1.5 Methodology & Sources of Information 1.5.1 Research Methodology 1.5.2 Research Process 1.5.3 Base Year 1.5.4 Report Assumptions & Caveats 2 Global Semiconductor Die Attach Materials Overall Market Size 2.1 Global Semiconductor Die Attach Materials Market Size: 2022 VS 2032 2.2 Global Semiconductor Die Attach Materials Revenue, Prospects & Forecasts: 2018-2032 2.3 Global Semiconductor Die Attach Materials Sales: 2018-2032 3 Company Landscape 3.1 Top Semiconductor Die Attach Materials Players in Global Market 3.2 Top Global Semiconductor Die Attach Materials Companies Ranked by Revenue 3.3 Global Semiconductor Die Attach Materials Revenue by Companies 3.4 Global Semiconductor Die Attach Materials Sales by Companies 3.5 Global Semiconductor Die Attach Materials Price by Manufacturer (2018-2023) 3.6 Top 3 and Top 5 Semiconductor Die Attach Materials Companies in Global Market, by Revenue in 2022 3.7 Global Manufacturers Semiconductor Die Attach Materials Product Type 3.8 Tier 1, Tier 2 and Tier 3 Semiconductor Die Attach Materials Players in Global Market 3.8.1 List
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